Tres notas sobre RAVEN RIDGE
- Muestran imagenesl del chip y algunos detalles de como esta estructurado.
- Anuncio Oficial de AMD
- Algunas pruebas no oficiales del rendimiento.
Dato curioso, se anuncia el mXFR o mobile-XFR
Desde techpowerup algunas imagenes del DIE de Raven Ridge. Y como era de esperar el modulo CCX [los 4 nucleos ZEN mas sus caches L1|L2 individuales y cache L3 compartida] esta interconectado via INFINITY FABRIC con el iGP basado en VEGA. De esta manera los buses del modulo de memoria RAM tiene conexion directa con el bus de datos del CCX y bus de datos del iGP, con lo cual; en teoria; se le sacaria el mayor provecho tanto a los nucleso ZEN como al GPU integrado tanto para graficos como para copmputo heterogeneo.
Quiza y por primera vez un APU no tenga su iGP ahogado por falta de ancho de banda con la RAM. Y esto si es un hecho: Seria el priomer APU con memoria cache L3.
https://www.techpowerup.com/238175/amd- ... n-detailedAMD "Raven Ridge" Silicon Detailedby btarunr
The "Zen" CPU micro-architecture seems to be turning AMD's fortunes as it reported its first black quarter in years. The 14 nm "Zeppelin" or "Summit Ridge" die is at the heart of this change. This 8-core CPU die is implemented on everything from performance mobile packages, to single-die mainstream-desktop socket AM4 under the Ryzen 3, Ryzen 5, and Ryzen 7-series, 2-die high-end desktop (HEDT) multi-chip modules under Ryzen Threadripper, and the 4-die enterprise multi-chip modules under the EPYC brand. The next logical step for AMD with its new "Zen" CPU IP was to fuse it with the "Vega" graphics architecture, and give its APU lineup a much needed overhaul. At the heart of this move is the new 14 nm "Raven Ridge" silicon.
While "Summit Ridge" is the combination of two "Zen" CCX (quad-core CPU complex) units making up an 8-core CPU die that lacks integrated graphics, the "Raven Ridge" silicon combines one "Zen" CCX with an integrated graphics core based on the "Vega" architecture. AMD's new Infinity Fabric interconnect ferries data between the CCX and the iGPU, and not an internal PCIe link. The CCX houses four "Zen" CPU cores with 64 KB of L1I cache, 32 KB of L1D cache, 512 KB of dedicated L2 cache, and 4 MB of L3 cache shared between the four cores.
The integrated graphics core is a different beast. It features similar (albeit scaled-down) front-end and back-ends from the "Vega 10" silicon, a similar video engine, and an SIMD area with 10 "Vega" next-gen compute units (NGCUs). This works out to a stream processor count of 640. Other key specifications include 40 TMUs, and 16 ROPs.
The video engine is now extremely capable, supporting hardware-accelerated decoding of CODECs such as VP9 10-bpc and HEVC 10-bpc at frame-rates of up to 240 for 1080p, and 60 for 4K UHD. It can also encode H.265 8-bpc at frame-rates of up to 120 at 1080p, and 30 at 4K UHD. You finally get to use the display connectors on your socket AM4 motherboards, as the iGPU supports DisplayPort 1.4 and HDMI 2.0b, with resolutions of up to 3840 x 2160 @ 60 Hz with HDR, 1440p @ 144 Hz, and 1080p @ 240 Hz.
The Infinity Fabric interconnect forms the backbone of this silicon, as it connects all key components with each other, including the "Zen" CCX, the "Vega" iGPU, the display engine, the multimedia engine, the integrated northbridge, as well as the integrated southbridge (since like "Summit Ridge," "Raven Ridge" is an SoC).
The integrated northbridge features a dual-channel DDR4 integrated memory controller supporting up to 64 GB of memory at clock speeds of up to DDR4-3200; and a PCI-Express gen 3.0 root complex with a 28-lane budget. This means that besides the x4 A-Link chipset bus, the M.2 PCIe slots on typical machines will be wired to the APU. The integrated southbridge puts out two SATA 6 Gbps ports, and four USB 3.0 ports.
AMD seems so have increased the amount of power-gating on its silicon. Disabled or idling components triggered by lower power-states, are now power-gated (their power-supply cut off), and not clock-gated (their clock cadence cut-off). The chip is peppered with multiple LDO (low-dropout regulator) regions for the CCX, iGPU, and uncore regions, with a common VDD package rail for both the off-chip (on motherboard) and on-chip voltage controllers.
Each component has a PG (power-gatable) region and an AON (always-on) region. The AON region is to make sure the component doesn't disappear from the address table while the system is running. The total max current requirements as a result of such as design change, have been reduced by as much as 36 percent.
Por su parte AMD hace la presentacion de dos modelos del APU Raven Ridge.
AMD (NASDAQ: AMD) today announced the introduction of the AMD Ryzen™ mobile processor, previously codenamed the “Raven Ridge” mobile APU, providing leadership performance and a complete entertainment experience with optimal efficiency for premium 2-in-1s, convertibles and ultrathin notebook computers. With a configurable 15-watt TDP, the AMD Ryzen™ 7 2700U and AMD Ryzen™ 5 2500U processors combine the architectures of award-winning “Zen” x86 cores--featuring AMD SenseMI Technology processor-level intelligence--with revolutionary Radeon “Vega” graphics in a System-on-Chip design to achieve unprecedented ultrathin notebook performance. The AMD Ryzen 7 2700U is the fastest processor for ultrathin notebooks, with up to 44% more multi-threaded CPU performance as well as up to 161% more graphics performance than the competition.
“We promised to bring innovation and competition back to every segment of the PC market in 2017, and today marks the fulfillment of that promise for consumer notebooks following our successful roll-out across the consumer, commercial and high-end desktop markets earlier this year,” said Jim Anderson, senior vice president and general manager, Computing and Graphics Group, AMD. “Ryzen™ mobile processors offer leadership performance for everyday activities, multi-tasking, and advanced workloads alike, all while enabling amazing battery life. We are pleased to deliver the world’s fastest processor for ultrathin notebooks, offering consumers the opportunity to get the most out of their digital lives through our OEM partners’ notebook designs.”
AMD claims the Ryzen Mobile APUs feature triple the CPU performance, 2.3x the GPU performance and up to 58 percent lower power consumption than the previous generation of AMD mobile APUs. These are also the first AMD mobile processors with Precision Boost 2 and Mobile Extended Frequency Range (mXFR):
new Precision Boost 2 technology, which accelerates processor performance in workloads using from one to many CPU cores
Mobile Extended Frequency Range (mXFR), which raises sustained performance in notebooks with great cooling solutions and certified for “Ultimate XFR Performance”
The first laptops with Ryzen Mobile APUs will arrive in the coming weeks. Acer, HP and Lenovo will be the first, with further platform updates expect from Dell and other OEMs in early 2018.
.Pruebas de rendimientohttps://videocardz.com/73702/amd-launch ... a-graphics
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, el ordenador voy a pedirlo montado a PcComponentes, por lo que me dijeron otros compis debería venir testeado y actualizado a la ultima versión. A ver si hay alguien en el foro que lo haya hecho para confirmarlo. 